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What's the HS Code for "Batteries"?

8506.8

More details about this classification are below the fold, such as the duty rate, PGAs, additional tariffs, and legal notes...

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Harmonized Tariff Schedule (Batteries HS Code)

How does the tariff book describe the HS Code for "Batteries"?

XVI
View Notes
Section XVI: Machinery and Mechanical Appliances; Electrical Equipment; Parts Thereof; Sound Recorders and Reproducers, Television Image and Sound Recorders and Reproducers, and Parts and Accessories of Such Articles
85
View Notes
Chapter 85: Electrical machinery and equipment and parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles
8506
View Notes
Primary cells and primary batteries; parts thereof:
8506.80.00
Other primary cells and primary batteries

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PGAs

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Additional Tariffs and Duties

Special Provisions, including China and Russia import laws, Countervailing, and Antidumping

Depending on the country of origin, intended use, and other factors, an imported Batteries may require one or more other HS Codes in addition to 8506.8 and ā€” correspondingly ā€” a different duty rate.

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Tariff Legal Notes

XVI
Section XVI: Machinery and Mechanical Appliances; Electrical Equipment; Parts Thereof; Sound Recorders and Reproducers, Television Image and Sound Recorders and Reproducers, and Parts and Accessories of Such Articles

HTSUS Notes

SECTION XVI
MACHINERY AND MECHANICAL APPLIANCES;
ELECTRICAL EQUIPMENT; PARTS THEREOF; SOUND
RECORDERS AND REPRODUCERS, TELEVISION IMAGE
AND SOUND RECORDERS AND REPRODUCERS, AND PARTS
AND ACCESSORIES OF SUCH ARTICLES
XVI-1
Notes
  • 1. This section does not cover:
    • (a) Transmission, conveyor or elevator belts or belting, of plastics of chapter 39, or of vulcanized rubber (heading 4010), or other articles of a kind used in machinery or mechanical or electrical appliances or for other technical uses, of vulcanized rubber other than hard rubber (heading 4016);
    • (b) Articles of leather or of composition leather (heading 4205) or of furskin (heading 4303), of a kind used in machinery or mechanical appliances or for other technical uses;
    • (c) Bobbins, spools, cops, cones, cores, reels or similar supports, of any material (for example, chapter 39, 40, 44 or 48 or section XV);
    • (d) Perforated cards for Jacquard or similar machines (for example, chapter 39 or 48 or section XV);
    • (e) Transmission or conveyor belts or belting of textile material (heading 5910) or other articles of textile material for technical uses (heading 5911);
    • (f) Precious or semiprecious stones (natural, synthetic or reconstructed) of headings 7102 to 7104, or articles wholly of such stones of heading 7116, except unmounted worked sapphires and diamonds for styli (heading 8522);
    • (g) Parts of general use, as defined in note 2 to section XV, of base metal (section XV), or similar goods of plastics (chapter 39);
    • (h) Drill pipe (heading 7304);
    • (ij) Endless belts of metal wire or strip (section XV);
    • (k) Articles of chapter 82 or 83;
    • (l) Articles of section XVII;
    • (m) Articles of chapter 90;
    • (n) Clocks, watches or other articles of chapter 91;
    • (o) Interchangeable tools of heading 8207 or brushes of a kind used as parts of machines (heading 9603); similar interchangeable tools are to be classified according to the constituent material of their working part (for example, in chapter 40, 42, 43, 45 or 59 or heading 6804 or 6909);
    • (p) Articles of chapter 95; or
    • (q) Typewriter or similar ribbons, whether or not on spools or in cartridges (classified according to their constituent material, or in heading 9612 if inked or otherwise prepared for giving impressions), or monopods, bipods, tripods and similar articles, of heading 9620.
  • 2. Subject to note 1 to this section, note 1 to chapter 84 and to note 1 to chapter 85, parts of machines (not being parts of the articles of heading 8484, 8544, 8545, 8546 or 8547) are to be classified according to the following rules:
    • (a) Parts which are goods included in any of the headings of chapter 84 or 85 (other than headings 8409, 8431, 8448, 8466, 8473, 8487, 8503, 8522, 8529, 8538 and 8548) are in all cases to be classified in their respective headings;
    • (b) Other parts, if suitable for use solely or principally with a particular kind of machine, or with a number of machines of the same heading (including a machine of heading 8479 or 8543) are to be classified with the machines of that kind or in heading 8409, 8431, 8448, 8466, 8473, 8503, 8522, 8529 or 8538 as appropriate. However, parts which are equally suitable for use principally with the goods of headings 8517 and 8525 to 8528 are to be classified in heading 8517, and parts which are suitable for use solely or principally with the goods of heading 8524 are to be classified in heading 8529;
    • (c) All other parts are to be classified in heading 8409, 8431, 8448, 8466, 8473, 8503, 8522, 8529 or 8538 as appropriate or, failing that, in heading 8487 or 8548.
  • 3. Unless the context otherwise requires, composite machines consisting of two or more machines fitted together to form a whole and other machines designed for the purpose of performing two or more complementary or alternative functions are to be classified as if consisting only of that component or as being that machine which performs the principal function.
  • 4. Where a machine (including a combination of machines) consists of individual components (whether separate or interconnected by piping, by transmission devices, by electric cables or by other devices) intended to contribute together to a clearly defined function covered by one of the headings in chapter 84 or chapter 85, then the whole falls to be classified in the heading appropriate to that function.
  • 5. For the purposes of these notes, the expression "machine" means any machine, machinery, plant, equipment, apparatus or appliance cited in the headings of chapter 84 or 85.
  • 6.
    • (A) Throughout the tariff schedule, ?electrical and electronic waste and scrap? means electrical and electronic assemblies, printed circuit boards, and electrical or electronic articles that:
      • (a) have been rendered unusable for their original purposes by breakage, cutting-up or other processes or are economically unsuitable for repair, refurbishment or renovation to render them fit for their original purposes; and
      • (b) are packaged or shipped in a manner not intended to protect individual articles from damage during transportation, loading and unloading operations.
    • (B) Mixed consignments of ?electrical and electronic waste and scrap? and other waste and scrap are to be classified in heading 8549.
    • (C) This section does not cover municipal waste, as defined in note 4 to chapter 38.
Additional U.S. Note
  • 1. For the purposes of this section, the term "printed circuit assembly"means goods consisting of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements. For the purposes of this note,"active elements" means diodes, transistors and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits of heading 8542.
Statistical Note
  • 1. Provisions for semiconductor manufacturing and testing machines and apparatus cover products for the growth and processing of semiconductor materials, such as silicon and gallium arsenide, the processing of such materials into semiconductor devices and the testing of such devices (in general the testing equipment, as well as some of the processing equipment, is classified in chapter 90). More specifically the goods include the following:
    • (a) Wafer manufacturing equipment:
      • (i) Crystal growers & pullers - used to produce extremely pure monocrystalline semiconductor boules from which wafers can be sliced. Most common methods employed in these crystal growers and pullers are the Czochralski and float zone methods.
      • (ii) Wafer preparation equipment:
        • (A) Crystal grinders - used to grind the crystal boule to precise diameter required for wafers and to grind the flats on the boule to indicate the conductivity type and resistivity of the crystal.
        • (B) Wafer slicing saws - used to slice wafers from a boule of monocrystalline semiconductor material.
        • (C) Wafer grinders, lappers and polishers - used to prepare the semiconductor wafer for the fabrication process. This involves bringing the wafer within dimensional tolerances. Especially critical is the flatness of its surface.
    • (b) Mask fabrication and repair equipment:
      • (i) Fabrication equipment - used to transfer design patterns to a mask or reticle, this equipment generally utilizes optical, electron beam or X-rays to write circuit patterns on photoresist coated substrates. After development, these substrates become the mask or reticle for wafer fabrication.
      • (ii) Repair equipment - this equipment generally utilizes focused ion beams or laser beams. They are used directly on the mask or reticle to remove chrome.
    • (c) Wafer fabrication equipment:
      • (i) Film formation equipment - used to apply or produce various films on the surface of the wafer during the fabrication process. These films serve as conductors, insulators and semiconductors on the finished device. They may include oxides and nitrides of the substrate surface, metals, and epitaxial layers. The processes and equipments listed below are not necessarily limited to the generation of a particular type of film.
        • (A) Oxidation furnaces - used to form a "film" of oxide on the wafer. The oxide is formed by the chemical reaction of the top molecular layers of the wafer with the applied oxygen or steam under heat.
        • (B) Chemical Vapor Deposition (CVD) equipment - used to deposit various types of films which are obtained by combining the appropriate gases in a reactant chamber at elevated temperatures. This constitutes a thermochemical vapor-phase reaction. Operations may take place at atmospheric or low pressure (LPCVD) and may use plasma enhancement (PECVD).
        • (C) Physical Vapor Deposition (PVD) equipment - used to deposit various types of films which are obtained by vaporizing a solid.
          • (1) Evaporation equipment - in which the film is generated by heating the source material.
          • (2) Sputtering equipment - in which the film is generated by bombarding the source material (target) with ions.
        • (D) Molecular Beam Epitaxy (MBE) equipment - used to grow epitaxial layers on a heated monocrystalline substrate in an ultrahigh vacuum using beams of molecules. The process is similar to PVD.
      • (ii) Doping equipment - which is used to introduce dopants into the wafer surface in order to modify the conductivity or other characteristics of a semiconductor layer:
        • (A) Thermal diffusion equipment - in which the dopants are introduced into the surface of the wafer by the application of gases under high temperatures.
        • (B) Ion Implantation - in which the dopants are "driven" into the crystal lattice structure of the surface of the wafer in the form of a beam of accelerated ions.
        • (C) Annealing furnaces - which are used to repair the crystal lattice structures of the wafer damaged by ion implantation.
      • (iii) Etching and stripping equipment - used for etching or cleaning surfaces of the wafers.
        • (A) Wet etching equipment - in which chemical etching materials are applied by spraying or immersion. Spray etchers provide more uniform results than bath etchers, since they perform the operation on one wafer at a time.
        • (B) Dry plasma etching - in which etching materials are presented as gases within a plasma energy field, providing an anisotropic etch profile.
        • (C) Ion beam milling equipment - in which ionized gas atoms are accelerated toward the wafer surface. The impact results in the top layer being physically removed from the surface.
        • (D) Strippers or ashers - using techniques similar to etching, this apparatus removes the spent photoresist from the surface of the wafer after it has served its purpose as a "stencil". This equipment is also used for removal of nitrides, oxides, and polysilicon, with an isotropic etch profile.
      • (iv) Lithography equipment - used to transfer the circuit designs to the photoresist coated surface of the semiconductor wafer.
        • (A) Equipment for coating wafers with photoresist - these include the photoresist spinners which are used to apply liquid photoresist evenly over the surface of the wafer.
        • (B) Equipment for exposing the photoresist coated wafer with the circuit design (or a part thereof):
          • (1) Using a mask or reticle and exposing the photoresist to light (generally ultraviolet) or, in some instances, X-rays:
            • (a) Contact printers - where the mask or reticle is in contact with the wafer during exposure.
            • (b) Proximity aligners - similar to contact aligners except actual contact does not take place between the mask or reticle and the wafer.
            • (c) Scanning aligners - which use projection techniques to expose a continuously moving slit across the mask and wafer.
            • (d) Step and repeat aligners - which use projection techniques to expose the wafer a portion at a time. Exposure can be by reduction from the mask to the wafer or 1:1. Enhancements include the use of an excimer laser.
          • (2) Direct write on wafer equipment - these apparatus operate with no mask or reticle. They use a computer controlled "writing beam" (such as an electron beam (E-beam), ion beam or laser) to "draw" the circuit design directly on the photoresist coated wafer.
        • (C) Equipment for developing exposed wafers - these include chemical baths similar to those used in photographic laboratory applications.
    • (d) Assembly equipment:
      • (i) Dicing equipment - these include sawing machines and scribing machines (including laser scribers) and dicing accessories such as wafer breaking equipment.
      • (ii) Die bonding equipment - which installs the die to the package by soldering or gluing
      • (iii) Wire bonding equipment - used for attaching thin wires or tapes (usually of gold, aluminum or copper) from the die bonding pads to the corresponding pads on the package.
      • (iv) Packaging equipment - which are used to encapsulate or package a semiconductor device. They include sealing furnaces, lid welders, plastic encapsulation presses, lead trim and form equipment, package deflashers, and tin dip and solder plate equipment.
    • (e) Testing and inspection equipment:
      • (i) Optical inspection equipment - These include equipment that "examines" portions of the wafer surface and compares them either to a standard pattern or to other portions of the wafer surface.
      • (ii) Electrical testing equipment - These include computer controlled systems that test the functions and electrical specifications of semiconductor devices through the application and detection of electrical signals or patterns. Testing is performed on both unencapsulated dice and packaged integrated circuits.

Chapter 85 View Section Notes
Electrical machinery and equipment and parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles

HTSUS Notes

CHAPTER 85
ELECTRICAL MACHINERY AND EQUIPMENT AND PARTS THEREOF; SOUND RECORDERS
AND REPRODUCERS, TELEVISION IMAGE AND SOUND RECORDERS AND REPRODUCERS,
AND PARTS AND ACCESSORIES OF SUCH ARTICLES
XVI
85-1
Notes
  • 1. This chapter does not cover:
    • (a) Electrically warmed blankets, bed pads, foot-muffs or the like; electrically warmed clothing, footwear or ear pads or other electrically warmed articles worn on or about the person;
    • (b) Articles of glass of heading 7011;
    • (c) Machines and apparatus of heading 8486;
    • (d) Vacuum apparatus of a kind used in medical, surgical, dental or veterinary sciences (heading 9018); or
    • (e) Electrically heated furniture of chapter 94.
  • 2. Headings 8501 to 8504 do not apply to goods described in heading 8511, 8512, 8540, 8541 or 8542.
    However, metal tank mercury arc rectifiers remain classified in heading 8504.
  • 3. For the purposes of heading 8507, the expression "electric accumulators" includes those presented with ancillary components which contribute to the accumulator's function of storing and supplying energy or protect it from damage, such as electrical connectors, temperature control devices (for example, thermistors) and circuit protection devices. They may also include a portion of the protective housing of the goods in which they are to be used.
  • 4. Heading 8509 covers only the following electromechanical machines of the kind commonly used for domestic purposes:
    • (a) Floor polishers, food grinders and mixers, and fruit or vegetable juice extractors, of any weight;
    • (b) Other machines provided the weight of such machines does not exceed 20 kg, exclusive of extra interchangeable parts or detachable auxiliary devices.
    The heading does not, however, apply to fans or ventilating or recycling hoods incorporating a fan, whether or not fitted with filters (heading 8414), centrifugal clothes dryers (heading 8421), dishwashing machines (heading 8422), household washing machines (heading 8450), roller or other ironing machines (heading 8420 or 8451), sewing machines (heading 8452), electric scissors (heading 8467) or to electrothermic appliances (heading 8516).
  • 5. For the purposes of heading 8517, the term ?smartphones? means telephones for cellular networks, equipped with a mobile operating system designed to perform the functions of an automatic data processing machine such as downloading and running multiple applications simultaneously, including third-party applications, and whether or not integrating other features such as digital cameras and navigational aid systems.
  • 6. For the purposes of heading 8523:
    • (a) "Solid-state non-volatile storage devices "(for example,"flash memory cards" or "flash electronic storage cards") are storage devices with a connecting socket, comprising in the same housing one or more flash memories (for example, "FLASH EĀ²PROM") in the form of integrated circuits mounted on a printed circuit board. They may include a controller in the form of an integrated circuit and discrete passive components, such as capacitors and resistors;
    • (b) The term "smart cards" means cards which have embedded in them one or more electronic integrated circuits (a microprocessor, random access memory (RAM) or read-only memory (ROM)) in the form of chips. These cards may contain contacts, a magnetic stripe or an embedded antenna but do not contain any other active or passive circuit elements.
  • 7. For the purposes of heading 8524, ?flat panel display modules? refer to devices or apparatus for the display of information equipped at a minimum with a display screen, which are designed to be incorporated into articles of other headings prior to use. Display screens for flat panel display modules include, but are not limited to, those which are flat, curved, flexible, foldable or stretchable in form. Flat panel display modules may incorporate additional elements, including those necessary for receiving video signals and the allocation of those signals to pixels on the display. However, heading 8524 does not include display modules which are equipped with components for converting video signals (e.g., a scaler IC, decoder IC or application processer) or have otherwise assumed the character of goods of other headings.
    For the classification of flat panel display modules defined in this Note, heading 8524 shall take precedence over any other heading in the tariff schedule.
  • 8. For the purposes of heading 8534 "printed circuits" are circuits obtained by forming on an insulating base, by any printing process (for example, embossing, plating-up, etching) or by the "film circuit" technique, conductor elements, contacts or other printed components (for example, inductances, resistors, capacitors) alone or interconnected according to a pre-established pattern, other than elements which can produce, rectify, modulate or amplify an electrical signal (for example, semiconductor elements).
    The term "printed circuits" does not cover circuits combined with elements other than those obtained during the printing process, nor does it cover individual, discrete resistors, capacitors or inductances. Printed circuits may, however, be fitted with non-printed connecting elements.
    Thin- or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading 8542.
  • 9. For the purpose of heading 8536, "connectors for optical fibres, optical fibre bundles or cables" means connectors that simply mechanically align optical fibres end to end in a digital line system. They perform no other function, such as the amplification, regeneration or modification of a signal.
  • 10 Heading 8537 does not include cordless infrared devices for the remote control of television receivers or other electrical equipment (heading 8543).
  • 11. For the purposes of heading 8539, the expression "light-emitting diode (LED) light sources" covers:
    • (a) "Light-emitting diode (LED) modules" which are electrical light sources based on light-emitting diodes (LED) arranged in electrical circuits and containing further elements like electrical, mechanical, thermal or optical elements. They also contain discrete active elements, discrete passive elements, or articles of heading 8536 or 8542 for the purposes of providing power supply or power control. Light-emitting diode (LED) modules do not have a cap designed to allow easy installation or replacement in a luminaire and ensure mechanical and electrical contact.
    • (b) "Light-emitting diode (LED) lamps" which are electrical light sources containing one or more LED modules containing further elements like electrical, mechanical, thermal or optical elements. The distinction between light-emitting diode (LED) modules and light-emitting diode (LED) lamps is that lamps have a cap designed to allow easy installation or replacement in a luminaire and ensure mechanical and electrical contact.
  • 12. For the purposes of headings 8541 and 8542:
    • (a) (i) "Semiconductor devices" are semiconductor devices the operation of which depends on variations in resistivity on the application of an electric field or semiconductor-based transducers.
      Semiconductor devices may also include assembly of plural elements, whether or not equipped with active and passive device ancillary functions.
      "Semiconductor-based transducers" are, for the purposes of this definition, semiconductor-based sensors, semiconductor-based actuators, semiconductor-based resonators and semiconductor-based oscillators, which are types of discrete semiconductor-based devices, which perform an intrinsic function, which are able to convert any kind of physical or chemical phenomena or an action into an electrical signal or an electrical signal into any type of physical phenomenon or an action.
      All the elements in semiconductor-based transducers are indivisibly combined, and may also include necessary materials indivisibly attached, that enable their construction or function.
      The following expressions mean:
      (1) "Semiconductor-based" means built or manufactured on a semiconductor substrate or made of semiconductor materials, manufactured by semiconductor technology, in which the semiconductor substrate or material plays a critical and unreplaceable role of transducer function and performance, and the operation of which is based on semiconductor properties including physical, electrical, chemical and optical properties.
      (2) "Physical or chemical phenomena" relate to phenomena, such as pressure, acoustic waves, acceleration, vibration, movement, orientation, strain, magnetic field strength, electric field strength, light, radioactivity, humidity, flow, chemicals concentration, etc.
      (3) "Semiconductor-based sensor" is a type of semiconductor device, which consists of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical quantities and converting these into electric signals caused by resulting variations in electric properties or displacement of a mechanical structure.
      (4) "Semiconductor-based actuator" is a type of semiconductor device, which consists of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of converting electric signals into physical movement.
      (5) "Semiconductor-based resonator" is a type of semiconductor device, which consists of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures in response to an external input.
      (6) "Semiconductor-based oscillator" is a type of semiconductor device, which consists of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures.
      • (ii) "Light-emitting diodes (LED)" are semiconductor devices based on semiconductor materials which convert electrical energy into visible, infra-red or ultra-violet rays, whether or not electrically connected among each other and whether or not combined with protective diodes. Light-emitting diodes (LED) of heading 8541 do not incorporate elements for the purposes of providing power supply or power control;
    • (b) "Electronic integrated circuits" are:
      • (i) Monolithic integrated circuits in which the circuit elements (diodes, transistors, resistors, capacitors, inductances, etc.) are created in the mass (essentially) and on the surface of a semiconductor or compound semiconductor material (for example, doped silicon, gallium arsenide, silicon germanium, iridium phosphide) and are inseparably associated;
      • (ii) Hybrid integrated circuits in which passive elements (resistors, capacitors, inductances, etc.), obtained by thin- or thick-film technology, and active elements (diodes, transistors, monolithic integrated circuits, etc.), obtained by semiconductor technology, are combined to all intents and purposes indivisibly, by interconnections or interconnecting cables, on a single insulating substrate (glass, ceramic, etc.). These circuits may also include discrete components;
      • (iii) Multichip integrated circuits consisting of two or more interconnected monolithic integrated circuits combined to all intents and purposes indivisibly, whether or not on one or more insulating substrates, with or without leadframes, but with no other active or passive circuit elements.
      • (iv) Multi-component integrated circuits (MCOs): a combination of one or more monolithic, hybrid, or multi-chip integrated circuits with at least one of the following components: silicon-based sensors, actuators, oscillators, resonators or combinations thereof, or components performing the functions of articles classifiable under heading 8532, 8533, 8541, or inductors classifiable under heading 8504, formed to all intents and purposes indivisibly into a single body like an integrated circuit, as a component of a kind used for assembly onto a printed circuit board (PCB) or other carrier, through the connecting of pins, leads, balls, lands, bumps, or pads.
        For the purpose of this definition:
        • 1. ?Components? may be discrete, manufactured independently then assembled onto the rest of the MCO, or integrated into other components.
        • 2. ?Silicon-based? means built on a silicon substrate, or made of silicon materials, or manufactured onto integrated circuit die.
        • 3. (a) "Silicon-based sensors" consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical phenomena and transducing these into electric signals, caused by resulting variations in electric properties or displacement of a mechanical structure. "Physical or chemical phenomena" relates to phenomena, such as pressure, acoustic waves, acceleration, vibration, movement, orientation, strain, magnetic field strength, electric field strength, light, radioactivity, humidity, flow, chemicals concentration, etc.
          (b) ?Silicon-based actuators? consist of microelectronic and mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of converting electrical signals into physical movement.
          (c) ?Silicon-based resonators? are components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures in response to an external input.
          (d) ?Silicon-based oscillators? are active components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures.
    For the classification of the articles defined in this note, headings 8541 and 8542 shall take precedence over any other heading in the Nomenclature, except in the case of heading 8523, which might cover them by reference to, in particular, their function.
Subheading Notes
  • 1. Subheading 8525.81 covers only high-speed television cameras, digital cameras and video camera recorders having one or more of the following characteristics:
    - writing speed exceeding 0.5 mm per microsecond;
    - time resolution 50 nanoseconds or less;
    - frame time exceeding 225,000 frames per second.
  • 2. In respect of subheading 8525.82, radiation-hardened or radiation-tolerant television cameras, digital cameras and video camera recorders are designed or shielded to enable operation in a high-radiation environment. These cameras are designed to withstand a total radiation dose of at least 50 x 103 Gy (silicon)(5 x 106 RAD (silicon)), without operational degradation.
  • 3. Subheading 8525.83 covers night vision television cameras, digital cameras and video camera recorders which use a photocathode to convert available light to electrons, which can be amplified and converted to yield a visible image. This subheading excludes thermal imaging cameras (generally subheading 8525.89).
  • 4. Subheading 8527.12 covers only cassette players with built-in amplifier, without built-in loudspeaker, capable of operating without an external source of electric power and the dimensions of which do not exceed 170 mm x 100 mm x 45 mm.
  • 5. For the purposes of subheadings 8549.11 to 8549.19, ?spent primary cells, spent primary batteries and spent electric accumulators: are those which are neither usable as such because of breakage, cutting-up, wear or other reasons, nor capable of being recharged.
Additional U.S. Notes
  • 1. For the purposes of headings 8501 and 8503, 746 watts (W) is taken to be equivalent to 1 horsepower (hp).
  • 2. For the purposes of subheading 8516.72, the term "toasters" includes toaster-ovens which are designed essentially for toasting bread but can also bake small items, such as potatoes.
  • 3. For the purposes of headings 8517 and 8525 the term "transceivers" refers to combinations of radio transmitting and receiving equipment in a common housing, employing common circuit components for both transmitting and receiving, and which are not capable of simultaneously receiving and transmitting.
  • 4. For the purposes of 8529.90.05, 8529.90.06, 8529.90.33, 8529.90.36, 8529.90.43, 8529.90.46, 8529.90.88 and 8529.90.89:
    • (a) Each subassembly that contains as a component, or is covered in the same entry with, one or more of the following television components, viz.,
      tuner, channel selector assembly, antenna, deflection yoke, degaussing coil, picture tube mounting bracket, grounding assembly, parts necessary for fixing the picture tube or tuner in place, consumer-operated controls or speaker,
      shall be classified in subheading 8529.90.05, 8529.90.33, 8529.90.43 or 8529.90.88, as appropriate; and
    • (b) Each subassembly shall be counted as a single unit, except that two or more different printed circuit boards or ceramic substrates covered by the same entry and designed for assembly into the same television models shall be counted as one unit.
  • 5. Picture tubes imported in combination with, or incorporated into, other articles are to be classified in subheadings 8540.11 through 8540.12, inclusive, unless they are--
    • (a) incorporated into complete television receivers, as defined in additional U.S. note 6 below;
    • (b) incorporated into fully assembled units such as word processors, ADP terminals, or similar articles;
    • (c) put up in kits containing all the parts necessary for assembly into complete television receivers, as defined in additional U.S. note 6 below; or
    • (d) put up in kits containing all the parts necessary for assembly into fully assembled units such as word processors, ADP terminals, or similar articles.
  • 6. For the purposes of additional U.S. note 5 above the term "complete television receivers" means television receivers, fully assembled in their cabinets, whether or not packaged or tested for distribution to the ultimate purchaser(s).
  • 7. For the purposes of this chapter, references to "high definition" as it applies to television receivers and cathode-ray tubes refer to articles having:
    • (a) a screen aspect ratio equal to or greater than 16:9; and
    • (b) a viewing screen capable of displaying more than 700 scanning lines.
  • 8. For the purposes of this chapter, the video display diagonal is determined by measuring the maximum straight line dimension across the visible portion of the faceplate used for displaying video.
  • 9. Subheadings 8529.90.29, 8529.90.33, 8529.90.36 and 8529.90.39 cover the following parts of television receivers (including video monitors and video projectors):
    • (a) Video intermediate (IF) amplifying and detecting systems;
    • (b) Video processing and amplification systems;
    • (c) Synchronizing and deflection circuitry;
    • (d) Tuners and tuner control systems; and
    • (e) Audio detection and amplification systems.
  • 10. For the purposes of subheading 8540.91.15, the term "front panel assembly" refers to:
    • (a) with respect to a color cathode-ray television picture tube, an assembly which consists of a glass panel and a shadow mask or aperture grille, attached for ultimate use, which is suitable for incorporation into a color cathode-ray television picture tube (including video monitor cathode-ray tube), and which has undergone the necessary chemical and physical processes for imprinting phosphors on the glass panel with sufficient precision to render a video image when excited by a stream of electrons; or
    • (b) with respect to a monochrome cathode-ray picture tube, an assembly which consists of either a glass panel or a glass envelope, which is suitable for incorporation into a monochrome cathode-ray television picture tube (including video monitor or video projector cathode-rate tube), and which has undergone the necessary chemical and physical processes for imprinting phosphors on the glass panel or glass envelope with sufficient precision to render a video image when excited by a stream of electrons.
  • 11. For the purposes of subheading 8538.90.10, the expression "articles described in additional U.S. note 11 to chapter 85" means any of the following goods: photocopying apparatus of subheading 8443.32.30, 8443.32.50, 8443.39.20 or 8443.39.40; word processing machines of heading 8469; articles of heading 8470 or heading 8471; automatic teller machines of subheading 8472.90.10; articles of subheadings 8486.10 through 8486.40; articles of heading 8517; articles of subheading 8519.50; transmission apparatus of subheading 8525.50.10; articles of subheading 8525.60; digital still image cameras of subheading 8525.89.40; articles of subheading 8543.70.93; plotters of subheading 9017.10.40 or 9017.20.70; instruments and apparatus of heading 9026; instruments and apparatus of heading 9027 except of subheading 9027.10 or 9027.90.20; instruments and apparatus of subheading 9030.40; instruments and apparatus of subheading 9030.82; optical instruments and appliances of subheading 9031.41; optical instruments and appliances of subheading 9031.49.70; articles of subheading 9031.80.40.
  • 12. For the purposes of subheading 8517.69.00, the term "paging receivers" includes paging alert devices designed merely to emit a sound or visual signal (e.g., flashing light) upon the reception of a pre-set radio signal.
Statistical Notes
  • 1. For the purposes of this chapter the terms "AM" and "FM" refer to the entertainment broadcast bands of 550-1650 kHz and 88-108MHz, respectively.
  • 2. For statistical reporting purposes under subheading 8539.10, the size of a sealed beam lamp unit is determined by measuring the largest diagonal dimension across the faceplate.
  • 3. For statistical reporting purposes under subheading 8544.70, the unit of quantity "fiber m", as it pertains to optical fiber cables, is determined by multiplying the number of individual fibers contained therein by the length in meters.
  • 4. For statistical reporting purposes in heading 8542 the following definitions will apply:
    • (a) The term "static read-write random access (SRAM)" refers to integrated circuit memory devices in which the memory cells may be addressed in any sequence, randomly, for the storage or retrieval of data and in which in which the stored information is retained without further intervention as long as electric power is supplied to the device.
    • (b) The term "volatile memory" refers to integrated circuit memory devices which lose all stored information in the absence of electric power.
    • (c) The term "dynamic read-write random access (DRAM)" refers to integrated circuit memory devices in which the memory cells may be addressed in any sequence, randomly, for the storage or retrieval of data and in which the stored information must continually be refreshed in order to hold the information in memory.
    • (d) The term "electrically erasable programmable read-only memory (EEPROM)" refers to user programmable integrated circuit memory devices which retain the stored information in the absence of electric power and in which the stored information may be altered electrically.
    • (e) The term "erasable (except electrically) programmable read-only memory (EPROM)" refers to user programmable integrated circuit memory devices which retain the stored information in the absence of electric power and from which the stored information may be removed (except electrically). Such devices are usually erased by exposure to ultraviolet light after which they may be rewritten with new information.
    • (f) The term "microprocessor" refers to a central processing unit (CPU) fabricated as a monolithic integrated circuit.
    • (g) The term "kilobit" refers to 1,024 bits of data storage capacity, the term "megabit" refers to 1,024 kilobits of data storage capacity, and the term "gigabit" refers to 1,024 megabits of data storage capacity.
  • 5. For statistical reporting purposes under subheading 8532.22, the diameter of aluminum electrolytic capacitors not having a circular cross-section shall be the maximum dimension measured through the center.
  • 6. For the purposes of statistical reporting number 8544.42.9010, "Extension cords" is defined as a flexible cord assembly incorporating an electrical plug conforming to types 1-15P, 5-15P or 5-20P of the National Electrical Manufacturers Association (NEMA) and one or more receptacles conforming to NEMA type 1-15R, 5-15R or 5-20R.
  • 7. For statistical reporting purposes under subheading 8539.52.00, the types of light-emitting (LED) lamps are defined by American National Standards Institute for Electric Lamps as follows:
    • (a) ANSI shapes A, BT, P, PS or T described under 8539.52.0010, except for the straight linear tubes or U-shaped tubes of statistical reporting number 8539.52.0051;
    • (b) ANSI shapes B, BA, C, CA, DC, F, G or ST described under 8539.52.0020;
    • (c) ANSI shapes R, BR or PAR described under 8539.52.0030; or
    • (d) ANSI shapes MR11, MR16 or MRX16 described under 8539.52.0040.
  • 8. For the purposes of heading 8501, photovoltaic generators consist of panels of photocells combined with other apparatus, e.g., storage batteries and electronic controls (voltage regulator, inverter, etc.) and panels or modules equipped with elements, however simple (for example, diodes to control the direction of the current), which supply the power directly to, for example, a motor, an electrolyser. In these devices, electricity is produced by means of solar cells which convert solar energy directly into electricity (photovoltaic conversion).
  • 9. For the purposes of statistical reporting numbers 8501.71.0000, 8501.72.1000, 8501.72.2000, 8501.72.3000, 8501.72.9000, 8501.80.1000, 8501.80.2000, 8501.80.3000, 8501.80.9000, 8507.20.8010, 8541.42.0010, 8541.42.0080, 8541.43.0010 and 8541.43.0080, importers should report the total watts at maximum power based on standard test conditions according to the latest revision of International Electrotechnical Commission (IEC) 60904, "Photovoltaic Devices.?
  • 10. For the purposes of statistical reporting numbers 8541.42.0010 and 8541.43.0010, the term "crystalline silicon photovoltaic cells" means crystalline silicon photovoltaic cells of a thickness equal to or greater than 20 micrometers, having a p/n junction (or variant thereof) formed by any means, whether or not the cell imported under statistical reporting number 8541.42.0010 (or subassemblies thereof imported under statistical reporting number 8541.43.0010) has undergone other processing, including, but not limited to, cleaning, etching, coating, and/or addition of materials (including, but not limited to, metallization and conductor patterns) to collect and forward the electricity that is generated by the cell. Such cells include photovoltaic cells that contain crystalline silicon in addition to other photovoltaic materials. This includes, but is not limited to, passivated emitter rear contact cells, heterojunction with intrinsic thin-layer cells, and other so-called hybrid cells.
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